Many diverse products can benefit from the versatility offered by Apex 3D circuits 3DMPSTM. Good candidate products combine relatively low circuit density with molded plastic housings, cables, connectors, heat sinks, antennas, or chip carriers. By combining several of these elements into a single molded part the overall simplicity and reliability invariably are boosted using Apex 3D circuits 3DMPSTM.
Some specific examples of products that have been made using this technology are:
Cellphone internal or "invisible" antennas. These antennas are frequently made using a "planar inverted F" or "PIFA" antenna design. PIFA antennas made with 3DMPSTM can directly utilize a molded plastic substrate with custom dielectric properties (dielectric can be custom blended or tailored to your exact needs) and low RF losses while also keeping good mechancial properties, moldability, and cheap raw materials.
Another good example of Apex 3D circuits 3DMPSTM is this automotive part- combining molded connectors, SMT soldered component pads (on high temp molded substrate), conventional flat PCB solder interconnection, semi-hermetic sealed molded enclosure, heat spreader, sheilding (no extra cost), and easy assembly. This one part replaced a separate metal enclosure, several connectors, cables, and heat sinks while also providing another layer of circuitry for layout... This is a great example of the integrated function that 3DMPSTM can provide for your application!
A third example is provided in this 3DMPSTM application for interconnection of a small 3D sensor system. Previously the individual parts for sensing the orthogonal axes were separately mounted, interconnected, and aligned using various fixtures and techniques. Now the single molded 3D circuit part enables very accurate mounting of the sensors and simple, fully self-contained operation of the 3D sensor as a functional module rather than the separate pieces and processes.
Some specific examples of products that have been made using this technology are:
Cellphone internal or "invisible" antennas. These antennas are frequently made using a "planar inverted F" or "PIFA" antenna design. PIFA antennas made with 3DMPSTM can directly utilize a molded plastic substrate with custom dielectric properties (dielectric can be custom blended or tailored to your exact needs) and low RF losses while also keeping good mechancial properties, moldability, and cheap raw materials.
Another good example of Apex 3D circuits 3DMPSTM is this automotive part- combining molded connectors, SMT soldered component pads (on high temp molded substrate), conventional flat PCB solder interconnection, semi-hermetic sealed molded enclosure, heat spreader, sheilding (no extra cost), and easy assembly. This one part replaced a separate metal enclosure, several connectors, cables, and heat sinks while also providing another layer of circuitry for layout... This is a great example of the integrated function that 3DMPSTM can provide for your application!
A third example is provided in this 3DMPSTM application for interconnection of a small 3D sensor system. Previously the individual parts for sensing the orthogonal axes were separately mounted, interconnected, and aligned using various fixtures and techniques. Now the single molded 3D circuit part enables very accurate mounting of the sensors and simple, fully self-contained operation of the 3D sensor as a functional module rather than the separate pieces and processes.
